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Paperboard Interlayer Peel Strength Tester / Meter / Testing Machine / Equipment / Instrument / Apparatus / Device
Introduction
Microcomputer interlayer bond strength tester is mainly used to determine the bond strength of paper and paperboard. It is suitable for single-layer and multi-layer paper and paperboard, including coating paper,paper and paperboard covered with synthetic polymer film. Not suitable for low basis weight, porous, soft or low density paper and board. The interlayer bonding strength refers to the ability of paper and cardboard to resist separation between layers. It is a reflection of the internal bonding ability of paper and cardboard. The internal bonding strength can be completely controlled. This is very important for processing multilayer paper and cardboard. Low bonding values or uneven distribution may cause problems when tiling paper and cardboard in offset presses using viscous inks;if the bond strength value is too high, it will cause processing difficulties and increase the cost of the company.This test has a wide range of applications in multi-layer cardboard such as boxboard, white cardboard, gray board, and white cardboard in the printing and packaging industries.
Standards
GB / T 26203-2010 "Determination of bonding strength in paper and paperboard" (Scott type)
TAPPI T569pm-00 《Internal bond strength (Scott type)》
TAPPI T833pm-94
Technical Specifications:
Punch angle:90 °
Resolution: 0.1 J / m2;
Measuring range: A range: (20-500) J / m2, B range: (500 ~ 1000) J / m2.
Indication error: A range: ± 1J / m2, B range: ± 2J / m2.
Inductor: SH30-5000-2V
Sample size: 25.4mm × 25.4mm
Sample clamping force: 0 ~ 40kg / cm2 (adjustable)
Unit: J / m2, lbf / in2 interchange
Interface: 3.2in LCD display
Printing: Modular all-in-one thermal printer
Power supply: AC220V ± 22V, 50Hz, maximum current 3A, power supply should be reliably grounded.
Appearance size: 52cm × 42cm × 70cm
Weight: 62kg
Paperboard Interlayer Peel Strength Tester / Meter / Testing Machine / Equipment / Instrument / Apparatus / Device
Introduction
Microcomputer interlayer bond strength tester is mainly used to determine the bond strength of paper and paperboard. It is suitable for single-layer and multi-layer paper and paperboard, including coating paper,paper and paperboard covered with synthetic polymer film. Not suitable for low basis weight, porous, soft or low density paper and board. The interlayer bonding strength refers to the ability of paper and cardboard to resist separation between layers. It is a reflection of the internal bonding ability of paper and cardboard. The internal bonding strength can be completely controlled. This is very important for processing multilayer paper and cardboard. Low bonding values or uneven distribution may cause problems when tiling paper and cardboard in offset presses using viscous inks;if the bond strength value is too high, it will cause processing difficulties and increase the cost of the company.This test has a wide range of applications in multi-layer cardboard such as boxboard, white cardboard, gray board, and white cardboard in the printing and packaging industries.
Standards
GB / T 26203-2010 "Determination of bonding strength in paper and paperboard" (Scott type)
TAPPI T569pm-00 《Internal bond strength (Scott type)》
TAPPI T833pm-94
Technical Specifications:
Punch angle:90 °
Resolution: 0.1 J / m2;
Measuring range: A range: (20-500) J / m2, B range: (500 ~ 1000) J / m2.
Indication error: A range: ± 1J / m2, B range: ± 2J / m2.
Inductor: SH30-5000-2V
Sample size: 25.4mm × 25.4mm
Sample clamping force: 0 ~ 40kg / cm2 (adjustable)
Unit: J / m2, lbf / in2 interchange
Interface: 3.2in LCD display
Printing: Modular all-in-one thermal printer
Power supply: AC220V ± 22V, 50Hz, maximum current 3A, power supply should be reliably grounded.
Appearance size: 52cm × 42cm × 70cm
Weight: 62kg
Guangdong Hongtuo Instrument Technology Co.,Ltd has been specializing in density testing field on developing, innovating and producing since the year it was establised.